Hybrid Assembler / RF Wire Bonder III / Chelmsford, MA
Lockheed Martin •
Position Type: Permanent
Job Description:
Description:Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Duties include performing gold wire bonding using manual and automated 0.001” and 0.0007” machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components. This position requires wirebonding onto small pad sizes down to 0.001” in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
This position will require the capability to troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement. Duties will also include installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies. It also requires the utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications. Plans work sequence by assessing work in progress to schedule requirements. The position will also require collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
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Basic Qualifications:
• Experience in wirebonding and ribbon bonding (0.001” and 0.0007” wire and various sizes of ribbon)
• Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
• Good dexterity and eye/hand coordination
• Experience in microelectronics assembly (chip and wire assembly)
• Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
• Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills
• Candidate must be able to obtain a Secret Security Clearance and must have at least an Interim Secret Security clearance prior to start (must be a US citizen)
Desired Skills:
• Experience in hybrid assembly in accordance with Mil STD 883
• Experience wirebonding or ribbon bonding to ceramic or duroid substrates
• Experience using Westbond and Metcal bonding machines and Unitech welder.
• Experience in substrate and component attach, auto pick-and-place
• Experience operating auto or manual bonding equipment
• Familiarity working in an ESD and FOD controlled environment
• Experience in mechanical assembly processes of small electronic devices
• Experience working on military products in ISO 9001 / AS9100 controlled environments
Security Clearance Statement: This position requires a government security clearance, you must be a US Citizen for consideration.
Clearance Level: Secret
Other Important Information You Should Know
Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.
Ability to Work Remotely: Onsite Full-time: The work associated with this position will be performed onsite at a designated Lockheed Martin facility.
Work Schedules: Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility to our employees. Schedules range from standard 40 hours over a five day work week while others may be condensed. These condensed schedules provide employees with additional time away from the office and are in addition to our Paid Time off benefits.
Schedule for this Position: 4x10 hour day, 3 days off per week
Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
The application window will close in 90 days; applicants are encouraged to apply within 5 - 30 days of the requisition posting date in order to receive optimal consideration.
At Lockheed Martin, we use our passion for purposeful innovation to help keep people safe and solve the worlds most complex challenges. Our people are some of the greatest minds in the industry and truly make Lockheed Martin a great place to work.
With our employees as our priority, we provide diverse career opportunities designed to propel, develop, and boost agility. Our flexible schedules, competitive pay, and comprehensive benefits enable our employees to live a healthy, fulfilling life at and outside of work. We place an emphasis on empowering our employees by fostering an inclusive environment built upon integrity and corporate responsibility.
If this sounds like a culture you connect with, you’re invited to apply for this role. Or, if you are unsure whether your experience aligns with the requirements of this position, we encourage you to search on Lockheed Martin Jobs, and apply for roles that align with your qualifications.
Experience Level: Hourly/Non-Exempt
Business Unit: MISSILES AND FIRE CONTROL
Relocation Available: No
Career Area: Manufacturing
Type: Full-Time
Shift: First
• Experience in hybrid assembly in accordance with Mil STD 883
• Experience wirebonding or ribbon bonding to ceramic or duroid substrates
• Experience using Westbond and Metcal bonding machines and Unitech welder.
• Experience in substrate and component attach, auto pick-and-place
• Experience operating auto or manual bonding equipment
• Familiarity working in an ESD and FOD controlled environment
• Experience in mechanical assembly processes of small electronic devices
• Experience working on military products in ISO 9001 / AS9100 controlled environments
Job Ident #:
62304647952
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