Hybrid Assembler /RF Wire Bonder III / WK END SHIFT/ Chelmsford, MA
Lockheed Martin •
Description:Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Duties include performing wire bonding using using manual or automated .001 and .0007 machines and ribbon bonding to duroid or ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components; aluminum and gold wirebonding onto small pad sizes down to .001 mil in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
May require the capability to troubleshoot defective hybrids by visual screening wirebonds or chip placement. Duties could also include installation of substrates and components in highly complex microwave assemblies, utilizing using paste and sheet epoxies.
Performs disassembly, assembly, modification, rework and repair operations on various production subassemblies, assemblies and complete systems that utilize integrated circuit technology. Performs the above operations after the units have been rejected by testing and are sent back with test failure sheets, isolating the problem area. Plans work sequence by assessing work in progress to schedule requirements. Utilizes measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work to assure that the unit conforms to specifications. Collaborate with Manufacturing and Quality Engineering on procedures or to troubleshoot product to specifications.
•Experience in either wirebonding or ribbon bonding; Experience in microelectronics assembly
•Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools; Good dexterity, eye/hand coordination
•Ability to read and work from detailed process sheets and drawings; Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities;
•Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills
•Candidate must be able to obtain a Secret Security Clearance and must have at least an Interim Secret Security clearance prior to start
•Experience in hybrid assembly in accordance with Mil STD 883
•Ribbon bonding and welding of various sizes and on various material
•Wirebond skills such as gold wire bonding of in diameter.001 mil and .0007 mil to components or substrates; Experience wirebonding or ribbon bonding to ceramic or duroid substrates; Experience using Westbond and Metcal bonding machines and Unitech welder preferred.
•Experience in substrate and component attach, auto pick-and-place
•Experience operating auto or manual bonding equipment
•Familiarity working in an ESD and FOD controlled environment
•Experience in mechanical assembly processes of small electronic devices
•Experience working on military products in ISO 9001 / AS9100 controlled environments
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