CLEARANCE TYPE: Secret

TRAVEL: Yes, 10 of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact peoples lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nations history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, theyre making history.

The NGMC/FTAP group of Northrop Grumman Mission Systems is seeking a **Microelectronics Product Engineering Manager** for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Silicon Germanium, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman’s ground based radars, avionic radars, and space systems. Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country.

The **Microelectronics Product Engineering Manager** should possess a working knowledge of solid-state device physics, digital and RF circuit design and test, and experience in Front End of Line (FEOL) and/or Back End of Line (BEOL) device processing, integration, testing, and packaging.

Primary duties include managing the group responsible for developing, sustaining, qualifying, and delivering a diverse portfolio of products spanning multiple material systems and technology nodes. This includes working with design and test to understand physical and electrical sensitivities, characterizing and trending circuit performance, defining and benchspaning critical parameters and test vehicles, coordinating experiments, and analyzing experimental data, performing product debug and root cause analysis, monitoring and improving product yields, leading manufacturing cost reduction efforts, and coordinating both internal and externally manufactured device delivery.

Additionally, the manager will:

• Collaborate with supply chain, supplier quality, and PMO for incoming quality control of external wafer foundry and assembly operations, ensuring that all devices meet stringent quality and performance specifications upon receipt.

• Contribute to the development of a robust commercial business infrastructure, bridging technical expertise with spanet-driven strategies to support new and legacy product lines.

• Support the creation and implementation of internal test and assembly growth roadmaps, identifying key opportunities for process improvements, technology adoption, and resource allocation to further enhance operational capabilities.

The **Microelectronics Product Engineering Manager** will also coordinate with process engineering to develop and document process flows post wafer fabrication. They will assist customers in developing performance specifications and in testing complex devices. Other assignments may include ensuring timely procurement of starting materials, providing assembly process support, monitoring product qualification follow-up, and conducting product status reviews.

In addition, the **Microelectronics Product Engineering Manager** will work closely with new technology development principal investigators, designers, and program management to help develop and execute the product development and new product introduction strategy for devices built using the technology under development. The chosen individual must have an aptitude for laboratory and experimental work, as well as for the design of experiments. They must also be able to communicate effectively with employees at all levels in the organization and demonstrate excellent problem solving, data analysis, and critical thinking skills.

NGATL

Basic Qualifications:

• Bachelors degree in Electrical Engineering, Physics, Materials Engineering or other closely related technical field with 9+ years of relevant experience (7+ years with an MS or PhD)

• At least 3+ years of experience managing a team

• Experience with semiconductor process flows with critical dimensions at 250 nm or less and test vehicle development and benchspaning

• Yield enhancement and manufacturing experience

• Program Management experience

• This position requires the applicant to be a U.S. Citizen.

• Ability to obtain and maintain a U.S. Government Secret Security clearance per business requirements.

Preferred Qualifications:

• PhD degree in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering physical science discipline

• A strong background in solid state device physics, digital and RF circuit design and test

• Involvement with leading or participating in technology transfers and/or external foundry interface experience

• A thorough knowledge of advanced DC & RF device characterization techniques

• Experience with device and circuit characterization, including manipulation and plotting of large datasets

• Experience with the design and analysis of experiments using tools such as JMP

• Experience with the design and layout of process and device test structures

• IPA, MCM or 2.5D/3D Heterogeneous integration experience"

Primary Level Salary Range: $135,800.00 - $203,600.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidates experience, education, skills and current spanet conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.