Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Duties include performing gold wire bonding using manual and automated 0.001” and 0.0007” machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals, and other microelectronic components. This position requires wire-bonding onto small pad sizes down to 0.001” in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
This position will require the capability to troubleshoot defective hybrid circuit card assemblies by visually screening wire bonds or chip placement. Duties will also include the installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies. It also requires the utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to ensure that the unit conforms to specifications. Plans work sequence by assessing work in progress to schedule requirements. The position will also require collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
Basic Required Qualifications:
- Experience in wire bonding and ribbon bonding (0.001” and 0.0007” wire and various sizes of ribbon)
- Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers, and other similar tools
- Good dexterity and eye/hand coordination
- Experience in microelectronics assembly (chip and wire assembly)
- Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
- Ability to work in a diverse team environment; Good interpersonal, teaming, and communication skills
- Active secret clearance preferred, willing to consider candidates with a previously held active clearance. Interim secret clearance is required to start the position. (must be included on a resume)
- High School Diploma required
- Second Shift Hours 3:00 pm to 1:30 am
Desired Skills:
- Experience in the hybrid assembly in accordance with Mil-STD 883
- Experience wire-bonding or ribbon bonding to ceramic or duroid substrates
- Experience using Westbond and Metcal bonding machines and Unitech welders.
- Experience in substrate and component attach, auto pick-and-place
- Experience operating auto or manual bonding equipment
- Familiarity working in an ESD and FOD-controlled environment
- Experience in mechanical assembly processes of small electronic devices
- Experience working on military products in ISO 9001 / AS9100 controlled environments
PDS Defense, Inc. is committed to working with and providing reasonable accommodation to individuals with physical and mental disabilities. If you need special assistance or an accommodation while seeking employment, please call 1-866-224-2745 to contact us. We will make a determination on your request for reasonable accommodation on a case-by-case basis.
The law requires PDS Defense, Inc. to post a notice describing the Federal laws prohibiting job discrimination. For information regarding your legal rights and protections, please click on the following links: EEO is the Law and EEO is the Law Supplement
PDS Defense, Inc. will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay. Please see the Pay Transparency Nondiscrimination Provision for more information.
As a Federal Contractor, PDS Defense, Inc. is required to participate in the E-Verify Program to confirm eligibility to work in the United States.
The Company will consider qualified applicants with arrest and conviction records.
